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Contact us
HOICE Co., Ltd.
[Korea]
Address:
#205 Dimec, 17, Cheomdangieop1-ro, Sandong-myeon Gumi-si Chungcheongbuk-do 39171 Korea
Phone:
82-54-4724788
Contact name:
Park Cheonsik



HOICE Co., Ltd.
 
MEMS Microphone

MEMS Microphone

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MEMS Microphone

Click to enlarge image

 Origin

Korea


REC6
MEMS MICROPHONE

Introduction of Product

  • As shown in the figure above, the capacitors, which are mmounted on the surface of the PCB, can be removed by our product, EC(Embedded Capacitor)
  • The reliability of the Board is improved by the reduction in the number of the surface-mount capacitors.
  • Improvement of the Power Bus Noise reduction effects

Business Direction

In order to expand our market, Embedded Capacitor is applied not only to MEMS Microphone PCB, but also to Network and High Technology device PCB.

HOICE E/C Material Characteristics

Properties
Test Method
REC6
REC15
cp@1Mhz, nF/in2(pF/cm2)
GERI Method
11(1700)
3(460)
Dielectric Thickness, μm
Supplier Method
6
15
Copper Type
Supplier Method
RA
RA
Dk@MHz(@1GHz)
GERI Method
9(7)
9(7)
Loss Tangent @ 1MHz(@1GHz)
GERI Method
0.013(0.07)
0.013(0.07)
Dielectric Strength, kv/mm
GERI Method
33.7
33.7
Hi-Pot Test
GERI Method
>100V
>500V
Flammability
UL94
V-0
V-0
Tensile Strength, Mpa(kpsi)
GERI Method
158(23.0)
158(23.0)
Elongation, %
GERI Method
3.0
3.0
Glass Transition Temperature
KIT Method
200°C
200°C
CTE, ppm/°C, x-y d(40~100°C)/(100~200°C)
KIT Method
15/22
15/22
Degradation Temperature
KIT Method
355°C
355°C
Peel Strength(lbs/in)
Supplier Method
>4
>10
Halogen Contents
EN14582:2007
N.D.
N.D.
Heavy Metals
IEC 62321-5:2013
IEC 62321-7-1:2015
N.D.
N.D.
Flame Retardants-PBBs/PBDEs
IEC 62321-6:2015
N.D.
N.D.
PWB Processing
Supplier Method
Both side etching
Both side Etching

Core Technologies
Securing domestic monopoly

(Embedded Capacitor)

  • Capacitance(Cp) value: World-Class reserves
  • Excellent technique in binder composition and ispersion
  • Reducing turnaround time(TAT) for low-cost process
  • One-stop mass production system with UV laser cutting equipment(LMC-10)
  • Technology for applying low-cost materials

Comparison of Embedded Capacitor with other companies

For MEMS MICROPHONE PCB

Characteristics
HOICE Co., Ltd.
Company A
Company B
Company C
Cp value
1MHz 11nF/in2
1MHz 11nF/in2
1MHz 11nF/in2
1MHz 11nF/in2
HiPOT Voltage
100V
-
-
-
Dielectric Thickness
6μm
16μm
6μm
11μm
Remark
Available for Top & Bottom
 
 
 

For Network Device PCB

Characteristics
HOICE Co., Ltd.
Company A
Company D
Company E
Cp value
1MHz 3nF/in2
1MHz 3.1nF/in2
1MHz 4.5nF/in2
0.8nF/in2
0.5nF/in2
HiPOT Voltage
1000V
500V
500V
500V
500V
Dielectric Thickness
15μm
8μm
12μm
25μm
50μm
Remark
 
 
 
 
 


Related Keywords: MEMS Microphone


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